Original Article
  • Moisture Absorption and Strengths of Composite Skins cured on the Close Heated Mold

  • Kyung-Su Kim*, Hyeon-Seok Choe**, Byeong-Su Kwak*, Jin-Hwe Kweon*†

  • * School of Mechanical and Aerospace Engineering, Gyeongsang National University
    ** Department of Composite Structure & System, Korea Institute of Materials Science

  • 폐쇄형 가열 금형에서 경화된 복합재 외피의 수분흡수 및 강도특성

  • 김경수*·최현석**·곽병수*·권진회*†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The moisture absorption rate and structural strength changes of oven-cured composite skin based on closed molds were studied. Moisture absorption was performed on specimens with and without filler applied. The specimens were exposed to moisture for up to 231 days. Tensile and compression tests were conducted with and without filler application. As a result of the test, the moisture absorption rates of the tensile and compressive specimens without filler were 2.4 and 0.3% higher, respectively, than those with the filler applied. The tensile and compressive strengths of the specimen without filler applied were average 305 MPa and 139 MPa, respectively, and the tensile and compressive strengths of the specimen with filler applied were 313 MPa and 166 MPa, respectively, appeared high


폐쇄 금형 기반의 오븐 경화된 복합재 스킨에 대한 수분 흡수율 및 구조강도 변화를 연구하였다. 수분 함침은 필러를 도포한 시편과 도포하지 않은 시편에 대해 수행하였으며, 시편은 최대 231일 동안 수분에 노출하였다. 구조시험은 필러 도포 유무를 구분하여 인장 및 압축시험을 수행하였다. 시험 결과, 필러를 도포하지 않은 인장 및 압축시편의 수분 흡수율이 도포한 시편에 비해 각각 2.4, 0.3% 높게 나타났다. 필러를 도포하지 않은 시편의 평균 인장 강도는 305 MPa 압축강도는 139 MPa, 필러를 도포한 시편의 평균 313 MPa, 압축강도는 166 MPa로, 필러를 도포한 시편의 인장 및 압축강도가 높게 나타났다


Keywords: 흡습(Moisture absorption), 폐쇄 금형(Close mold), 필러(Filler)

This Article

Correspondence to

  • Jin-Hwe Kweon

  • School of Mechanical and Aerospace Engineering, Gyeongsang National University

  • E-mail: jhkweon@gnu.ac.kr