Original Article
  • Interfacial Evaluation and Nondestructive Damage Sensing of Carbon Fiber Reinforced Epoxy-AT-PEI Composites using Micromechanical Test and Electrical Resistance Measurement
  • Joung-Man Park, Dae-Sik Kim, Jin-Woo Kong, Minyoung Kim, Wonho Kim
  • Micromechanical 시험법과 전기저항 측정을 이용한 탄소섬유 강화 Epoxy-AT-PEI 복합재료의 비파괴적 손상 감지능 및 계면물성 평가
  • 박종만(경상대학교 응용화학공학부 고분자공학전공), 김대식(경상대학교 응용화학공학부 고분자공학전공 대학원), 공진우(한국기계연구원 복합재료그룹), 김민영(부산대학교 화학공학과), 김원호(부산대학교 화학공학과)
Abstract
Interfacial properties and damage sensing for the carbon fiber/epoxy-amine terminated (AT)-polyetherimide(PEI) composite were performed using microdroplet test and electrical resistance measurements. As AT-PEI contend increased, the fracture toughness of epoxy-AT-PEI matrix increased, and interfacial shear strength (IFSS) increased due to the improved fracture toughness by energy absorption mechanisms of AT-PEI phase. the microdroplet in the carbon fiber/neat epoxy composite showed brittle microfailure mode. At 15 phr AT-PEI content, ductile microfailure mode appeared because of improved fracture toughness. After curing, the change in electrical resistance (ΔR) with increasing AT-PEI content increased gradually because of thermal shrinkage. Under cyclic stress, in the neat epoxy case the reaching time until same stress was faster and their slope was higher than those of 15 phr AT-PEI. The result obtained from electrical resistance measurements under curing process and reversible stress/strain was correspondence well with matrix toughness properties.

Interfacial properties and damage sensing for the carbon fiber/epoxy-amine terminated (AT)-polyetherimide(PEI) composite were performed using microdroplet test and electrical resistance measurements. As AT-PEI contend increased, the fracture toughness of epoxy-AT-PEI matrix increased, and interfacial shear strength (IFSS) increased due to the improved fracture toughness by energy absorption mechanisms of AT-PEI phase. the microdroplet in the carbon fiber/neat epoxy composite showed brittle microfailure mode. At 15 phr AT-PEI content, ductile microfailure mode appeared because of improved fracture toughness. After curing, the change in electrical resistance (ΔR) with increasing AT-PEI content increased gradually because of thermal shrinkage. Under cyclic stress, in the neat epoxy case the reaching time until same stress was faster and their slope was higher than those of 15 phr AT-PEI. The result obtained from electrical resistance measurements under curing process and reversible stress/strain was correspondence well with matrix toughness properties.

Keywords: Damage sensing, Electrical resistivity, Interfacial shear strength (IFSS), Fracture toughness, Residual stress

Keywords: 손상감지능, 전기저항도, 계면전단강도, 파괴인성, 잔류응력

This Article

  • 2003; 16(2): 62-67

    Published on Apr 30, 2003