Original Article
  • Effect of Temperature on the Deposition Rate and Bending Strength Characteristics of Chemical Vapor Deposited Silicon Carbide Using Methyltrichlorosilane
  • Jun-Baek Song, Hangjoon Im, Young-Ju Kim, Youn-Woong Jung, Hee-Beom Ryu, Ju-Ho Lee
  • Department of Advanced Materials Engineering, Korea Polytechnic University, Siheung 15073, Korea,Department of Advanced Materials Engineering, Korea Polytechnic University, Siheung 15073, Korea, Corresponding author,R&D Center, DS Techno Co., Ltd., Wonju 26498, Korea
  • 메틸트리클로로실란을 이용한 화학증착 탄화규소의 증착율 및 굽힘강도 특성에 미치는 온도의 영향
  • 송준백, 임항준, 김영주, 정연웅, 류희범, 이주호
Abstract
The effects of deposition temperature on chemical vapor deposited silicon carbide (CVD-SiC) were studied to obtain high deposition rates and excellent bending strength characteristics. Silicon carbide prepared at 1250~1400°C using methyltrichlorosilane(MTS : CH3SiCl3) by hot-wall CVD showed deposition rates of 95.7~117.2 μm/hr. The rate-limiting reaction showed the surface reaction at less than 1300°C, and the mass transfer dominant region at higher temperature. The activation energies calculated by Arrhenius plot were 11.26 kcal/mole and 4.47 kcal/mole, respectively. The surface morphology by the deposition temperature changed from 1250oC pebble to 1300°C facet structure and multi-facet structure at above 1350°C. The cross sectional microstructures were columnar at below 1300°C and isometric at above 1350°C. The crystal phases were all identified as β-SiC, but (220) peak was observed from 1300°C or higher at 1250oC (111) and completely changed to (220) at 1400°C. The bending strength showed the maximum value at 1350°C as densification increased at high temperatures and the microstructure changed from columnar to isometric. On the other hand, at 1400°C, the increasing of grain size and the direction of crystal growth were completely changed from (111) to (220), which is the closest packing face, so the bending strength value seems to have decreased.

화학기상증착 탄화규소(CVD-SiC)의 높은 증착율과 우수한 굽힘강도 특성을 얻기 위해 증착온도에 대한 영향을 연구하였다. Hot-wall CVD 방법으로 메틸트리클로로실란(MTS : CH3SiCl3)을 이용하여 1250~1400oC 조건 에서 제조된 탄화규소는 95.7~117.2 μm/hr 정도의 증착율을 보였다. 율속반응은 1300°C 미만에서는 표면반응, 그 이상의 온도에서는 물질전달 지배영역 특성을 나타내었다. Arrhenius plot을 통해 계산한 활성화 에너지는 각각 11.26 kcal/mole과 4.47 kcal/mole이였다. 증착온도별 표면 형상은 1250°C pebble에서 1300°C facet 구조로 변하였고, 1350°C 이상에서는 multi-facet 구조를 나타내었다. 단면 형상은 1300°C 이하에서 columnar, 1350°C 이상에서 isometric 구 조를 보였다. 결정상은 모두 β-SiC로 확인되었지만 결정성장 방향은 1250°C (111)에서 1300°C 이상부터 (220) peak 가 관찰되었으며, 1400°C에서는 (220)으로 완전히 변함을 알 수 있었다. 굽힘강도 특성은 증착온도가 증가할수록 치밀화되고, columnar에서 isometric 조직으로 변화되면서 1350°C에서 최대값을 나타내었으며, 1400°C에서는 grain size 증가와 결정성장 방향이 최밀충진면인 (111)에서 (220)으로 완전히 변하면서 감소된 것으로 보인다.

Keywords: Chemical Vapor Deposition, Silicon Carbide, Deposition Temperature, Rate-limiting Reaction, Deposition Rate, Bending Strength

Keywords: 화학기상증착, 탄화규소, 증착온도, 율속반응, 증착율, 굽힘강도

This Article

  • 2018; 31(2): 43-50

    Published on Apr 30, 2018