Original Article
  • Low-temperature Fast-curing Cationic Latent Curing Agent for One-component Epoxy Adhesives for Electronic Materials

  • So Hyun An*,****,#, Han Gyeol Jang*,#, Young Hoon Joung*, Seung Jun Kim***, Myung Woong Kim***, Felix Sunjoo Kim****†, Jaewoo Kim*,**†

  • * Institute of Advanced Composite Materials, Korea Institute of Science and Technology (KIST), Wanju-gun, Jeonbuk 55324, Republic of Korea
    ** Convergence Research Center for Solutions to Electromagnetic Interference in Future-Mobility, Korea Institute of Science and Technology (KIST), Seoul 02792, Republic of Korea
    *** Department of Chemistry and Chemical Engineering, Inha University, Incheon 22212, Republic of Korea
    **** Department of Chemical Engineering and Materials Science, Chung-Ang University (CAU), Seoul 06974, Republic of Korea

  • 전자 재료용 일액형 에폭시 접착제를 위한 저온 속경화 잠재성 양이온 경화제

  • 안소현*,****,# · 장한결*,# · 정영훈* · 김승준*** · 김명웅*** · 김선주****† · 김재우*,**†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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This Article

Correspondence to

  • Felix Sunjoo Kim****, Jaewoo Kim*,**

  • * Institute of Advanced Composite Materials, Korea Institute of Science and Technology (KIST), Wanju-gun, Jeonbuk 55324, Republic of Korea
    ** Convergence Research Center for Solutions to Electromagnetic Interference in Future-Mobility, Korea Institute of Science and Technology (KIST), Seoul 02792, Republic of Korea
    **** Department of Chemical Engineering and Materials Science, Chung-Ang University (CAU), Seoul 06974, Republic of Korea

  • E-mail: fskim@cau.ac.kr, jaewoo96@kist.re.kr