Special Issue
  • Measurement and Analysis of the Material Behavior of Corrugated Paperboard for Finite Element Analysis

  • Gyu-Yeol Kang*, Duk-Geun Bae**, Sun-Jong Noh*, Sim-Won Chin*, Woo-Jong Kang***†

  • * Air Solution R&D Lab., LG Electronics
    ** Multi-Material Research Center, Korea Automotive Technology Institute
    *** School of Smart Engineering, Kyungil University

  • 유한요소해석을 위한 골판지 소재의 물성측정 및 분석

  • 강규열*· 배덕근**· 노선종*· 진심원*· 강우종***†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

References
  • 1. Fadiji, T., Berry, T., Coetzee, C., and Opara, U.L., “Investigating the Mechanical Properties of Paperboard Packaging Material for Handling Fresh Produce Under Different Environmental Conditions: Experimental Analysis and Finite Element Modelling,” Journal of Applied and Computational Mechanics, Vol. 9, No. 2, 2017, pp. 20-34.
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  • 2. Park, J.M., Park, M.J., Choi, D.S., Jung, H.M., and Hwang, S.W., “Finite Element-Based Simulation for Edgewise Compression Behavior of Corrugated Paperboard for Packaging of Agricultural Products,” Applied Sciences, Vol. 10, No. 19, 2020, pp. 6716-6723.
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  • 3. Kang, S.G., Im, J.M., Shin, K.B., and Choi, W.S., “Effective Equivalent Finite Element model for Impact Limiter of Nuclear Spent Fuel Shipping Cask made of Sandwich Composites Panels,” Composites Research, Vol. 28, No. 2, 2015, pp. 58-64.
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  • 4. Simon, J.W., “A Review of Recent Trends and Challenges in Computational Modeling of Paper and Paperboard at Different Scales,” Archives of Computational Methods in Engineering, Vol. 28, 2021, pp. 2409-2428.
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  • 5. Xia, Q.S., Mechanics of Inelastic Deformation and Delamination in Paperboard, Ph.D Thesis, Massachusetts Institute of Technology, USA, 2002.
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  • 6. Nygårds, M., Just, M., and Tryding, J., “Experimental and Numerical Studies of Creasing of Paperboard,” International Journal of Solids and Structures, Vol. 46, 2009, pp. 2493-2505.
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  • 7. Karlsson, J., Schill, M., and Tryding, J., “*MAT_PAPER and *MAT_COHESIVE_PAPER: Two New Models for Paperboard Materials,” 14th International LS-DYNA Users Conference, 2016, June 12-14.
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  • 8. Rodrigues, D., and Pereira, J., “Experimental Tests and Numerical Simulations for Failure Investigation on Corrugated Boxes Used on Household Appliance Packaging,” Journal of Applied Packaging Research, Vol. 10, No. 3, 2018, pp. 56-69.
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  • 9. Luong, V.D., Bonnin, A.S., Abbès, F., Nolot, J.B., Erre, D., and Abbès, B., “Finite Element and Experimental Investigation on the Effect of Repetitive Shock in Corrugated Cardboard Packaging,” Journal of Applied and Computational Mechanics, Vol. 7, No. 2, 2021, pp. 820-830.
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  • 10. LS-DYNA Keyword User’s Manual, ANSYS, 2024.
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  • 11. Sekhar, C., and Chatiri, M., “Corrugated Fiber Board as a Packaging Material: Experimental and Numerical Analysis of the Mechanical Behavior,” 15th International LS-DYNA Users Conference, 2018, June 10-12.
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  • 12. ASTM International, Standard Test Method for Tensile Properties of Paper and Paperboard Using Constant-Rate-of-Elongation Apparatus, 2002, ASTM D828-97.
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This Article

Correspondence to

  • Woo-Jong Kang

  • School of Smart Engineering, Kyungil University

  • E-mail: wjkang@kiu.ac.kr