Original Article
  • Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package

  • Seong Yeon Park*, Seung Yoon On*, Seong Su Kim*†

  • * Department of Mechanical Engineering, KAIST

  • 초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발

  • 박성연*· 온승윤*· 김성수*†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

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This Article

Correspondence to

  • Seong Su Kim

  • Department of Mechanical Engineering, KAIST

  • E-mail: seongsukim@kaist.ac.kr