Original Article
  • Recyclable Polymeric Composite with High Thermal Conductivity
  • Haeun Shin*,**‡, Chae Bin Kim***‡, Seokhoon Ahn*, Doohun Kim*, Jong Kuk Lim**, Munju Goh****†

  • * Institute of Advanced Composite Materials, Korea Institute of Science and Technology, Wanju 55324, Korea
    ** Department of Chemistry, Chosun University, Gwangju 61452, Korea
    *** Department of Polymer Science and Engineering, Pusan National University, Busan 46241, Korea
    ****† Department of Chemical Engineering, Konkuk University, Seoul 05029, Korea
    ‡ Equally contributed co-first authors.

  • 재활용 가능한 고방열 고분자 복합소재 개발
  • 신하은*,**‡ · 김채빈*** · 안석훈* · 김두헌* · 임종국** · 고문주****

References
  • 1. Moore, G.E., “Cramming More Components onto Integrated Circuits,” Proceedings of the IEEE, Vol. 6, No. 1, 1998, pp. 82-85.
  •  
  • 2. Bates, C.M., Maher, M.J., Janes, D.W., Ellison, C.J., and Willson, C.G., “Block Copolymer Lithography,” Macromolecules, Vol. 47, No. 1, 2014, pp. 2-12.
  •  
  • 3. Kim, S.O., Solar, H.H., Stoykovich, M.P., Ferrier, N.J., de Pablo, J.J., and Nealey, P.F., “Epitaxial Self Assembly of Block Copolymers on Lithographically Defined Nanopatterned Substrates,” Nature, Vol. 424, 2003, pp. 411-414.
  •  
  • 4. Stoykovich, M.P., Muller, M., Kim, S.O., Solak, H.H., Edwards, E.W., de Pablo, J.J., and Nealey, P.F., “Directed Assembly of Block Copolymer Blends into Nonregular Device-Oriented Structures,” Science, Vol. 308, No. 5727, 2005, pp. 1442-1446.
  •  
  • 5. Ruiz, R., Kang, H., Detcheverry, F.A., Dobisz, E., Kercher, D.S., Albrecht, T.R., de Pablo, J.J., and Nealey, P.F., “Density Multiplication and Improved Lithography by Directed Block Copolymer Assembly,” Science, Vol. 321, No. 5891, 2008, pp. 936-939.
  •  
  • 6. Moore, A.L., and Shi, L., “Emerging Challenges and Materials for Thermal Management of Electronics,” Materials Today, Vol. 17, No. 4, 2014, pp. 163-174.
  •  
  • 7. Prasher, R., “Thermal Interface Materials: Historical Perspective, Status, and Future Directions,” Proceedings of the IEEE, Vol. 94, No. 8, 2006, pp. 1571-1586.
  •  
  • 8. Wong, C.P., and Bollampally, R.S., “Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging,” Journal of Applied Polymer Science, Vol. 74, 1999, pp. 3396-3403.
  •  
  • 9. Kang, D.G., Kim, N., Park, M., Nah, C., Kim, J.S., Lee, C.R., Kim, Y., Kim, C.B., Goh, M., and Jeong, K.U., “Interfacial Engineering for the Synergistic Enhancement of Thermal Conductivity of Discotic Liquid Crystal Composites,” ACS Applied Materials & Interfaces, Vol. 10, No. 4, 2018, pp. 3155-3159.
  •  
  • 10. Jeong, I., Kim, C.B., Kang, D.-G., Jeong, K.-U., Jang, S.G., You, N.-H., Ahn, S., Lee, D.-S., and Goh, M., “Liquid Crystalline Epoxy Resin with Improved Thermal Conductivity by Intermolecular Dipole-Dipole Interactions,” Journal of Polymer Science Part A: Polymer Chemistry, Vol. 57, No. 6, 2019, pp. 708-715.
  •  
  • 11. Yeo, H., Islam, A Md., You, N.-H., Ahn, S., Goh, M., Hahn, J.R., and Jang, S.G., “Characteristic Correlation between Liquid Crystalline Epoxy and Alumina Filler on Thermal Conducting Properties,” Composites Science and Technology, Vol. 141, 2017, pp. 99-105.
  •  
  • 12. Islam, A Md., Lim, H., You, N.-H., Ahn, S., Goh, M., Hahn, J.R., Yeo, H., and Jang, S.G., “Enhanced Thermal Conductivity of Liquid Crystalline Epoxy Resin using Controlled Linear Polymerization,” ACS Macro Letters, Vol. 7, No. 10, 2018, pp.1180-1185.
  •  
  • 13. Xu, X., Chen, J., Zhou, J., and Li, B., “Thermal Conductivity of Polymers and Their Nanocomposites,” Advanced Materials, Vol. 30, No. 17, 2018, 1705544.
  •  
  • 14. Kim, C.B., Lee, J., Cho, J., and Goh, M., “Thermal Conductivity Enhancement of Reduced Graphene Oxide via Chemical Defect Healing for Efficient Heat Dissipation,” Carbon, Vol. 139, 2018, pp. 386-392.
  •  
  • 15. Lee, J., Hwang, S., Lee, S.-K., Ahn, S., Jang, S.G., You, N.-H., Kim, C.B., and Goh, M., “Optimizing Filler Network Formation in Poly(hexahydrotriazine) for Realizing High Thermal Conductivity and Low Oxygen Permeation,” Polymer, Vol. 179, 2019, pp. 121639.
  •  
  • 16. Jiang, Q., Wang, X., Zhu, Y., Hui, D., and Qiu, Y., “Mechanical, Electrical and Thermal Properties of Aligned Carbon Nano-tube/Polyimide Composites,” Composites Part B: Engineering, Vol. 56, 2014, pp. 408-412.
  •  
  • 17. Zhu, H., Li, Y., Fang, Z., Xu, J., Cao, F., Wan, J., Preston, C., Yang, B., and Hu, L., “Highly Thermally Conductive Papers with Percolative Layered Boron Nitride Nanosheets,” ACS Nano, Vol. 8, No. 4, 2014, pp. 3606-3613.
  •  
  • 18. Song, W.L., Wang, P., Cao, L., Anderson, A., Meziani, M.J., Farr, A.J., and Sun, Y.-P., “Polymer/Boron Nitride Nanocomposite Materials for Superior Thermal Transport Performance,” Angewandte Chemie International Edition, Vol. 51, No. 26, 2012, pp. 6498-6501.
  •  
  • 19. Lin, Z., Liu, Y., Raghavan, S., Moon, K.S., Sitaraman, S.K., and Wong, C.P., “Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation,” ACS Applied Materials & Interfaces, Vol. 5, No. 15, 2013, pp. 7633-7640.
  •  
  • 20. Yuan, C., Duan, B., Li, L., Xie, B., Huang, M., and Luo, X., “Thermal Conductivity of Polymer Based Composites with Magnetic Aligned Hexagonal Boron Nitride Platelets,” ACS Applied Materials & Interfaces, Vol. 7, No. 23, 2015, pp. 13000-13006.
  •  
  • 21. Yousefi, N., Gudarzi, M.M., Zheng, Q.B., Aboutalebi, S.H., Sharif, F., and Kim, J.K., “Self-alignment and High Electrical Conductivity of Ultralarge Graphene Oxide-Polyurethane Nanocomposites,” Journal of Materials Chemistry, Vol. 22, No. 25, 2012, pp. 12709-12717.
  •  
  • 22. Liang, Q., Yao, X., Wang, W., Liu, Y., and Wong, C.P., “A Three-dimensional Vertically Aligned Functionalized Multilayer Graphene Architecture: An Approach for Graphene-based Thermal Interfacial Materials,” ACS Nano, Vol. 5, No. 3, 2011, pp. 2392-2401.
  •  
  • 23. Erb, R.M., Libanori, R., Rothfuchs, N., and Studart, A.R., “Composites Reinforced in Three Dimensions by using Low Magnetic Fields,” Science, Vol. 355, No. 6065, 2012, pp. 199-204.
  •  
  • 24. Erb, R.M., Son, H.S., Samanta, B., Rotello, V.M., and Yellen, B.B., “Magnetic Assembly of Colloidal Superstructures with Multipole Symmetry,” Nature, Vol. 457, 2009, pp. 999-1002.
  •  
  • 25. Lanticse, L.J., Tanabe, Y., Matsui, K., Kaburagi, Y., Suda, K., Hoteida, M., Endo, M., and Yasuda, E., “Shear-induced Preferential Alignment of Carbon Nanotubes Resulted in Anisotropic Electrical Conductivity of Polymer Composites,” Carbon, Vol. 44, No. 14, 2006, pp. 3078-3086.
  •  
  • 26. Terao, T., Zhi, C., Bando, Y., Mitome, M., Tang, C., and Golberg, D., “Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement,” Journal of Physical Chemistry C, Vol. 114, No. 10, 2010, pp. 4340-4344.
  •  
  • 27. Jan, R., May, P., Bell, A.P., Habib, A., Khan, U., and Coleman, J.N., “Enhancing the Mechanical Properties of BN Nanosheet-Polymer Composites by Uniaxial Drawing,” Nanoscale, Vol. 6, No. 9, 2014, pp. 4889-4895.
  •  
  • 28. Haggenmueller, R., Gommans, H.H., Rinzler, A.G., Fischer, J.E., and Winey, K.I., “Aligned Single Wall Carbon Nanotubes in Composites by Melt Processing Methods,” Chemical Physics Letters, Vol. 330, No. 3-4, 2000, pp. 219-225.
  •  
  • 29. Shin, H., Ahn, S., Lim, J.K., Kim, C.B., and Goh, M., “Recyclable Thermoplastic Hexagonal Boron Nitride Composites with High Thermal Conductivity,” Composites Part B: Engineering, Vol, 163, 2019, pp. 723-729.
  •  
  • 30. García, J.M., Jones, G.O., Virwani, K., McCloskey, B.D., Boday, D.J., ter Huurne, J.M., Horn, H.W., Coady, D.J., Bintaleb, A.M., Alabdulrahman, A.M.S., Alsewailem, F., Almegren, H.A.A., and Hedrick, J.L., “Recyclable, Strong Thermosets and Organogels via Paraformaldehyde Condensation with Diamines,” Science, Vol. 344, No. 6185, 2014, pp. 732-735.
  •  
  • 31. Kaminker, R., Callaway, E.B., Dolinski, N.D., Barbon, S.M., Shibata, M., Wang, H., Hu, J., and Hawker, C.J., “Solvent-free Synthesis of High-performance Polyhexahydrotriazine (PHT) Thermosets,” Chemistry of Materials, Vol. 30, No. 22, 2018, pp. 8352-8358.
  •  
  • 32. Lei, H., Wang, S., Liaw, D.J., Cheng, Y., Yang, X., Tan, J., Chen, X., Gu, J., and Zhang, Y., “Tunable and Processable Shape-Memory Materials Based on Solvent-Free Catalyst-Free Polycondensation between Formaldehyde and Diamine at Room Temperature,” ACS Macro Letters, Vol. 8, No. 5, 2019, pp. 582-587.
  •  
  • 33. Ho, M.-P., Wang, H., Lau, K.-T., Lee, J.-H., and Hui, D., “Interfacial Bonding and Degumming Effects on Silk Fibre/Polymer Biocomposites,” Composites Part B: Engineering, Vol. 43, 2012, pp. 2801-2812.
  •  
  • 34. Lu, T., Jiang, M., Jiang, Z., Hui, D., Wang, Z., and Zhou, Z., “Effect of Surface Modification of Bamboo Cellulose Fibers on Mechanical Properties of Cellulose/Epoxy Composites,” Composites Part B: Engineering, Vol. 51, 2013, pp. 28-34.
  •  
  • 35. Nielsen, L.E., “Generalized Equation for the Elastic Moduli of Composite Materials,” Journal of Applied Physics, Vol. 41, No. 11, 1970, pp. 4626-4627.
  •  
  • 36. Tanimoto, M., Yamagata, T., Miyata, K., and Ando, S., “Anisotropic Thermal Diffusivity of Hexagonal Boron Nitride-filled Polyimide Films: Effects of Filler Particle Size, Aggregation, Orientation, and Polymer Chain Rigidity,” ACS Applied Materials & Interfaces, Vol. 5, No. 10, 2013, pp. 4374-4382.
  •  
  • 37. Lee, K.H., Shin, H.J., Lee, J., Lee, I.Y., Kim, G.H., Choi, J.Y., and Kim, S.W., “Large-scale Synthesis of High-quality Hexagonal Boron Nitride Nanosheets for Large-Area Graphene Electronics,” Nano Letters, Vol. 12, No. 2, 2012, pp. 714-718.
  •  

This Article

Correspondence to

  • Munju Goh
  • Department of Chemical Engineering, Konkuk University, Seoul 05029, Korea

  • E-mail: mgoh@konkuk.ac.kr