Original Article
  • Comparative Study of Metal-Polyphenol Network Coating and Plasma Treatment for Surface Modification of Thin Film Membranes
  • Khin Moe Lwin*, Pyone Pyone Chit*, Nur Elis Sharmila Binti Zulazmi**, Jinseung Bae*, Sungsu Park*, Kyunghoon Kim*†

  • * School of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea
    ** Department of Global Smart City, Sungkyunkwan University, Suwon 16419, Republic of Korea

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Water is one of the important natural resources on earth whereas only 3% of the water is fresh and suitable for drinking. Membrane technology offers efficient and versatile solutions for various water treatment challenges, ranging from filtration and separation to desalination and water reuse. However, membrane fouling caused by contaminants remains a significant issue that impairs performance. Enhancing the surface hydrophilicity of membranes mitigates fouling and answers the recovery of membrane life span. Here, the two post-treatment technologies for surface hydrophilicity enhancement: surface coating and plasma treatment, were investigated, and compared the enhancement behavior originating from two. Several parameters for enhancing hydrophilicity such as surface morphologies, surface roughness, and bulk properties varied by two treatment methods are reported. As a result, it indicated an increase of surface hydrophilicity (i.e., from >35% to 60%) for both technical approaches, in which the surface coating technology offered superior wetting dynamics, revealing the absence of hydrophobic surface irregularities over the membrane surface.


Keywords: Hydrophilicity, Surface-coating, Surface modification, Plasma-treatment, Wetting

This Article

Correspondence to

  • Kyunghoon Kim
  • * School of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea

  • E-mail: kenkim@skku.edu