Original Article
  • Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package
  • Seong Yeon Park*, Seung Yoon On*, Seong Su Kim*

  • * Department of Mechanical Engineering, KAIST

  • 초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발
  • 박성연*· 온승윤*· 김성수*†

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.


In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage

본 연구에서는 면상 발열체인 CNT Heater를 이용한 EMC 패키지 경화 공정 시스템을 개발하기 위하여, 기존 Hot Press 공정과 CNT Heater 공정 시스템을 통해 제작한 EMC/Cu Bi-layer 패키지의 성능을 비교하여 CNT Heater 공정 시스템의 가능성을 확인하였다. CNT Heater 공정의 경화 사이클을 도출하기 위해 Rheometer를 이용해 EMC의 점성을 측정하였다. 앞서 언급한 두 공정에 의해 성형된 EMC/Cu Bi-layer 패키지에서 EMC 내부의 Void를 광학 현미경으로 분석하였다. 또한, C-Scanning Acoustic Microscope와 3D-Digital Image Correlation를 통해 EMC/Cu Bi-layer 패키지의 계면 Void와 휨을 분석하였다. 이러한 분석 결과를 기반으로, EMC 내부 및 EMC/Cu Bi-layer의 계면에서 Void가 없음을 확인하였으며, 상온에서의 휨 크기, Zero 휨 온도와 휨 크기 변화에서 차이가 없음을 확인하였다

Keywords: EMC/Cu Bi-layer Package, CNT Heater, Hot Press, Void, 휨(Warpage)

This Article

Correspondence to

  • Seong Su Kim
  • Department of Mechanical Engineering, KAIST

  • E-mail: seongsukim@kaist.ac.kr